GAT
TSG

TECHNOLOGY
Application Method Serigrafi 
Wet Film Thickness 20-34 μm
Chemical & Mechanical Resistance
Temperature Resistence
Energy Saving
Performance

• High quality surface & stable color
• Standard curing temperature
• High chemical & mechanical resistance
• Paints for tempered side glasses

GAT
SBL4

TECHNOLOGY
Application Method Sag Bending
Wet Film Thickness 20-34 μm
Chemical & Mechanical Resistance
Temperature Resistence
Energy Saving
Performance

• Compliance with OEM standards
• Low curing temperature
• Ultimate chemical & mechanical resistance
• Paints for gravity bending applications

GAT
EPBL

TECHNOLOGY
Application Method Press Bending 
Wet Film Thickness 20-34 μm
Chemical & Mechanical Resistance 
Temperature Resistence
Energy Saving
Performance

• Antistick enamel for laminated glass
• Compliance with OEM standards 
• Fast IR drying and low curing temperature
• Ultimate chemical & mechanical resistance